发明名称 |
ASSEMBLIES AND METHODS FOR REDUCING WARP AND BOW OF A FLEXIBLE SUBSTRATE DURING SEMICONDUCTOR PROCESSING |
摘要 |
<p>Methods are described for addressing the bowing and/or warping of flexible substrates, attached to a rigid carrier, which occurs as a result of the thermal challenges of semiconductor processing. In particular, viscoelastic adhesives are provided which can bond a flexible substrate to a rigid carrier and mediate the thermal mismatch which often is present due to the distinctly different materials properties of most flexible substrates, such as plastic films, with respect to rigid carriers, such as silicon wafers. Assemblies are also provided which are produced according to the methods described herein.</p> |
申请公布号 |
EP2274162(A1) |
申请公布日期 |
2011.01.19 |
申请号 |
EP20090729456 |
申请日期 |
2009.04.06 |
申请人 |
THE ARIZONA BOARD OF REGENTS, A BODY CORPORATE OFTHE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY |
发明人 |
O'ROURKE, SHAWN;LOY, DOUGLAS;JIANG, HANQING |
分类号 |
B32B7/12;B32B15/08;B32B27/36;H01L23/498;H05K3/00 |
主分类号 |
B32B7/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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