| 摘要 |
A lapping tool for lapping a wafer section in a well controlled manner, has a head with an actuator for bending the row tool, and a force multiplier coupled between the actuator and row tool to multiply the force generated by the actuator for application of greater bending force to the row tool than can be generated by the actuator. Furthermore, at least two actuators, which are controlled together, simultaneously apply force to one force multiplier, so as to further increase bending force. The increase in available force permits the use of a row tool of a ceramic or other material that is substantially stiffer than stainless steel, such as a row tool having a coefficient of thermal expansion that is substantially similar to that of the rowbar itself. The tool further includes structures for tilting or otherwise orienting the wafer section relative to the lapping plate.
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