WAFER CLEANING APPARATUS AND WAPER CLEANIGN METHOD USING THE SAME

摘要

PURPOSE: A wafer cleaning apparatus and a wafer cleaning method thereof are provided to efficiently implement the minute process work by restraining the generation of oxide generated on the surface of the wafer during cleaning the silicon wafer. CONSTITUTION: A first thin layer contactor(110) separates and discharges the gas dissolved in the solution for removing the oxide film or the ultra pure wafer. The solution for removing the oxide film comprises the hydrogen fluoride or BOE. A second thin film contactor(120) is supplied with the solution for removing the oxide film or the ultra pure water discharged from the first thin film contactor and removes the gas.