RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD USING THE SAME

摘要

PURPOSE: A resin composition for a printed circuit board is provided to impart tenacity and plasticity to a cured material by introducing an epoxy resin in which acrylic rubber particles with a core-shell structure are dispersed and to reduce thermal stress according to hardening shrinkage. CONSTITUTION: A resin composition for a printed circuit board includes a composite epoxy resin, hardener, curing accelerator and inorganic filler. The composite epoxy resin comprises an epoxy resin in which acrylic rubber particles with a core-shell structure are dispersed, a DGEBA(diglycidyl ether of bisphenol A)-based epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, and a phosphor-based epoxy resin.