Light emitting diode system, method for producing such a system, and backlighting device

摘要

A light-emitting diode system (1) comprising at least one light-emitting diode component (2), in which a light-emitting diode chip is arranged in a light-emitting diode housing (21) on a heat sink (22) which can be thermally connected at the rear side (25) of the light-emitting diode housing (21). A carrier plate (3) having a front side (34) and a rear side (31) and a hole for receiving the light-emitting diode component (2) is provided. The light-emitting diode component (2) projects into the hole from the rear side (31) of the carrier plate (3). An electrically insulating thermal connection layer (5) is applied at the rear side (31) of the carrier plate (3), said thermal connection layer being thermally conductively connected to the heat sink (22). A method for producing a light-emitting diode system is also described.