发明名称 |
Hybrid sensor module and sensing method using the same |
摘要 |
Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.
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申请公布号 |
US7870678(B2) |
申请公布日期 |
2011.01.18 |
申请号 |
US20070896908 |
申请日期 |
2007.09.06 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KWON OH JO;CHOI WON TAE;KWON KYOUNG SOO |
分类号 |
G01C17/00 |
主分类号 |
G01C17/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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