发明名称 Hybrid sensor module and sensing method using the same
摘要 Provided is a hybrid sensor module including first and second sensors that are attached on one surface of a printed circuit board (PCB) so as to detect two-axis signal components parallel to the PCB; a third sensor that is attached on one surface of the PCB such that the axial direction of the third sensor is tilted at a predetermined angle from a vertical direction of the PCB, the third sensor detecting a signal component sensed in the axial direction; and a signal correction unit that is connected to the first to third sensor and corrects signal components, detected from the respective sensors, into signal components of an orthogonal coordinate system.
申请公布号 US7870678(B2) 申请公布日期 2011.01.18
申请号 US20070896908 申请日期 2007.09.06
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KWON OH JO;CHOI WON TAE;KWON KYOUNG SOO
分类号 G01C17/00 主分类号 G01C17/00
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