发明名称 Quality of a thin layer through high-temperature thermal annealing
摘要 A method for forming a structure is provided and includes implanting an atomic species into a donor substrate having an upper surface at a given depth relative to the upper surface to form an embrittlement zone in the donor substrate, the embrittlement zone defining a removable layer within the donor substrate. The method further includes assembling the upper surface of the donor substrate to a receiver substrate. Additionally, the method includes detaching the removable layer from the donor substrate at the embrittlement zone, thereby forming a detachment surface on the removable layer, by high temperature annealing. The high temperature annealing includes a temperature upgrade phase to a predetermined maximum temperature, maintaining the maximum temperature for a predetermined exposure duration, and a temperature downgrade phase. The maximum temperature and the exposure duration are selected so as to prevent the appearance of significant defects at the detachment surface.
申请公布号 US7871900(B2) 申请公布日期 2011.01.18
申请号 US20070873299 申请日期 2007.10.16
申请人 S.O.I. TEC SILICON ON INSULATOR TECHNOLOGIES 发明人 BOURDELLE KONSTANTIN;NGUYEN NGUYET-PHUONG;SCHWARZENBACH WALTER
分类号 H01L21/30 主分类号 H01L21/30
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