发明名称 |
Method of manufacturing a conductor circuit, and a coil sheet and laminated coil |
摘要 |
A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the continuous conductor pattern.
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申请公布号 |
US7870665(B2) |
申请公布日期 |
2011.01.18 |
申请号 |
US20090351229 |
申请日期 |
2009.01.09 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
NOMURA TOSHIHIRO;HIGUCHI NAOTAKA |
分类号 |
H05K3/02;H01F5/00;H01R43/00;H05K3/00;H05K3/10 |
主分类号 |
H05K3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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