发明名称 Method of manufacturing a conductor circuit, and a coil sheet and laminated coil
摘要 A conductor circuit and method of manufacturing a conductor circuit. The method includes forming a continuous conductor pattern on an insulating substrate, and connecting a short-circuit wire at a first position on the continuous conductor pattern such that two or more points on the continuous conductor pattern are short-circuited to each other by the short-circuit wire at the first position. An electrolytic plating film is formed on the continuous conductor pattern while the short-circuit wire is connected to the continuous conductor pattern at the first position, and the short-circuit wire is removed from the first position on the continuous conductor pattern to uncover a first exposed portion of the continuous conductor pattern.
申请公布号 US7870665(B2) 申请公布日期 2011.01.18
申请号 US20090351229 申请日期 2009.01.09
申请人 IBIDEN CO., LTD. 发明人 NOMURA TOSHIHIRO;HIGUCHI NAOTAKA
分类号 H05K3/02;H01F5/00;H01R43/00;H05K3/00;H05K3/10 主分类号 H05K3/02
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