发明名称 |
Power plane and land pad feature to prevent human metal electrostatic discharge damage |
摘要 |
An IC package includes an IC die mounted on a substrate that includes an ESD protection structure formed within the substrate to dissipate any charge accumulation associated with the package's no-connect pins resulting from human body model ESD and/or voltage spikes during package testing. For some embodiments, the ESD protection structure includes a resistive element formed in the substrate between the no-connect pin and a power plane. For other embodiments, the ESD protection structure includes a conductive ring formed in the substrate and laterally surrounding the land pad of the no-connect pin. |
申请公布号 |
US7872346(B1) |
申请公布日期 |
2011.01.18 |
申请号 |
US20070999193 |
申请日期 |
2007.12.03 |
申请人 |
XILINX, INC. |
发明人 |
CHEE SOON SHIN;O'ROURKE EUGENE |
分类号 |
H01L23/52;H01L23/02;H01L23/48;H01L29/40 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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