| 摘要 |
Methods for fabricating semiconductor device structures are disclosed. In some embodiments, methods for fabricating semiconductor device structures may comprising forming at least one raised element on a surface of a substrate, the at least one raised element including sloped sides and a peak, aligning a strip comprising conductive material at least partially over the at least one raised element, and at least partially securing the strip to a surface of the at least one raised element and the surface of the substrate.
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