MOLDING APPARATUS FOR ELECTRONIC COMPONENTS

摘要

PURPOSE: A molding apparatus for manufacture of electronic components is provided to prevent a failure caused by sticking between a compression member and molding compound by limiting the downward movement of hardened molding compound. CONSTITUTION: A molding apparatus for manufacture of electronic components comprises an upper mold(10), a lower mold(20), and a compression member(30). A substrate(S) in which an electronic component is mounted is placed on the lower mold. The lower mold has a cavity formed in the location corresponding to the electronic component. The upper mold is mated with the lower mold from the top. The compression member is installed in the cavity of the lower mold and carried up and down in order to compress molding compound(C) upward in the cavity. A recessed portion(23) is formed on the upper circumference of the cavity of the lower mold so that the molding compound compressed by the compression member is accepted and hardened in the recessed portion.