发明名称 |
Method for packaging light-emitting diode |
摘要 |
Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
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申请公布号 |
US7871835(B2) |
申请公布日期 |
2011.01.18 |
申请号 |
US20090418552 |
申请日期 |
2009.04.03 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE;TOPCO TECHNOLOGIES CORP. |
发明人 |
YEH SHU-LING;CHUANG YA-LAN;TSAI PEI-JUNG;LIN CHIH-HSIANG;KAO HSIN-CHING;CHANG FENG-CHIH;WU TANG-JUNG |
分类号 |
H01L21/00;H01L21/31;H01L21/469 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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地址 |
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