| 摘要 |
Provided are a semiconductor device producing method making production steps therein simple while preventing a matter that wire bonding cannot be attained due to contamination of a bonding pad and preventing the generation of a warp in an adherend such as a substrate, a lead frame, or a semiconductor element, thereby improving the yield; an adhesive sheet used in this method; and a semiconductor device obtained by this method. The invention includes a pre-setting step of pre-setting a semiconductor element (13) to an adherend (11) through an adhesive sheet (12), and a wire bonding step of wire bonding the element (13) in the bonding temperatures range of 80 °C to 250 °C without performing any heating step, wherein, as the adhesive sheet (12), a sheet having a storage elastic modulus of 1 MPa or more in the temperature range of 80 °C to 250 °C or a storage elastic modulus of 1 MPa or more at any temperature in the temperature range before curing the sheet (12) is used. |
