发明名称 |
ANORDNUNG EINES ELEKTRISCHEN BAUELEMENTS UND EINER ZWEI-PHASEN-KÜHLVORRICHTUNG UND VERFAHREN ZUM HERSTELLEN DER ANORDNUNG |
摘要 |
At least one electric component, such as a power semiconductor component, has at least a two-phase cooling device having at least one evaporator. The evaporator has a liquefier with a structured liquefier surface for evaporating a cooling fluid, formed by an electric connecting line making electrical contact with an electric contact face of the component. The connecting line cools the power semiconductor component and a module equipped therewith. Isothermal cooling with a low thermal loading of the power semiconductor component or of the module is possible by virtue of the two-phase cooling device acting as an evaporating bath cooling system. The device is applied in the planar contact-making technology with a large surface by providing an electric component with an electric contact face and producing the electric connecting line to the evaporator surface on the contact face of the component. |
申请公布号 |
AT492904(T) |
申请公布日期 |
2011.01.15 |
申请号 |
AT20060764213T |
申请日期 |
2006.07.19 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
WOLFGANG, ECKHARD;MITIC, GERHARD |
分类号 |
H01L23/427;F28D15/02 |
主分类号 |
H01L23/427 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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