MOSAIK-SUBARRAY UND DIESBEZÜGLICHE SCHALTUNGEN UND TECHNIKEN
摘要
A method of manufacturing a multi-layer circuit board assembly from a plurality of printed circuit boards is described. Circuits on layers of at least two printed circuit boards are electrically connected by plated via holes drilled through the joined printed circuit board assembly. RF matching pads provided on at least one of the circuits are used to provide the desired insertion loss and impedance characteristics over the desired RF operating frequency band. The need to perform back-drill and back-fill operations can be eliminated by the method described.
申请公布号
AT492924(T)
申请公布日期
2011.01.15
申请号
AT20070813572T
申请日期
2007.07.31
申请人
RAYTHEON COMPANY
发明人
PUZELLA, ANGELO M.;CROWDER, JOSEPH M.;DUPUIS, PATRICIA S.;FALLICA, MICHAEL C.;FRANCIS, JOHN B.;LICCIARDELLO, JOSEPH A.