发明名称 |
VERFAHREN ZUR HERSTELLUNG EINER IN HARZ EINGEBETTETEN ELEKTRONISCHEN VORRICHTUNG |
摘要 |
There is disclosed a process for producing a resin-sealed type electronic device which comprises forming a dam frame on edge and side portions of a substrate loaded with a single or a plurality of electronic elements so as to encompass the electronic elements by sticking down a pressure sensitive adhesive sheet to the substrate, pouring a resin for sealing in the inside of the dam frame, and heat-curing the poured resin. The process dispenses with intricate production step or a long time in forming the dam frame, thus enabling to form the same with minimized number of production steps and shortest time. |
申请公布号 |
AT493759(T) |
申请公布日期 |
2011.01.15 |
申请号 |
AT20040104575T |
申请日期 |
2004.09.21 |
申请人 |
LINTEC CORPORATION |
发明人 |
SUGINO, TAKASHI;SHINODA, TOMONORI |
分类号 |
H01L21/56;H01L23/31;H01L23/24 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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