PRINTED CIRCUIT BOARD HAVING AN ELECTRO COMPONENT AND MANUFACTURING METHOD THEREOF
摘要
<p>PURPOSE: A printed circuit board having an electro-component and a manufacturing method thereof is provided to secure adhesive force between first and second insulator by forming them with the same resin material. CONSTITUTION: An inner circuit layer is formed in the surface of a core substrate(110). A cavity is penetrated through the core substrate. An electric component is built in the cavity. A first insulator is laminated in the top surface of the core substrate. The second insulator is laminated in the top surface and bottom surface of the core substrate. A reinforcing material(154) is impregnated in the second insulator. A circuit pattern(112) is formed in the second insulator.</p>
申请公布号
KR20110004593(A)
申请公布日期
2011.01.14
申请号
KR20090062095
申请日期
2009.07.08
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
LEE, SANG CHUL;CHUNG, YUL KYO;LEE, DOO HWAN;BAEK, SANG JIN