| 摘要 |
The present invention relates to a heat-sink device and a bulb-shaped LED lighting device using the same. The heat-sink device: comprises plural LEDs integrated on the surface of a substrate by a polygonal metal PCB and is able to maximize heat emission. The heat sink according to the invention includes: a body that has a central passage and is installed between an LED package into which the plural LEDs are integrated and a screw cap which applies electric power to the LED package; and heat-sink pins that are integrated with the body and spirally extended on the outer plane of the body, wherein uniform gaps are formed between the heat-sink pins along the length of the body. The invention enables efficient emission of the heat conducted from the LED package even though the plural LEDs are densely mounted. |
