PURPOSE: A method for manufacturing a smart card which improved a chip bonding method is provided to connect a connection terminal of a board and a terminal of an antenna coil with a conductive material as a medium by indirect heat. CONSTITUTION: An antenna terminal(134) is installed in a end part. According to the edge of one side, an antenna coil(132) is wired. A chip arrangement hole(136) passes through an antenna sheet(130). A conductive ball is laminated on an antenna terminal. A chip is inserted in the chip arrangement hole. A first and a second connection terminals and the antenna terminal is connected by indirect heat of a heating rod. A module sheet is laminated on the antenna sheet.
申请公布号
KR101008459(B1)
申请公布日期
2011.01.14
申请号
KR20100084767
申请日期
2010.08.31
申请人
JIN, YOUNG BUM;KUMOH NATIONAL INSTITUTE OF TECHNOLOGY INDUSTRY-ACADEMIC COOPERATION FOUNDATION;KIM, SUN HEE
发明人
ROH, JAE SEUNG;RYU, SEOK HUN;JIN, YOUNG BUM;KIM, SUN HEE