| 摘要 |
PURPOSE: A method of manufacturing a wafer level package is provided to improve the reliability of a wafer level package by preventing the delamination of an insulating layer formed in lower part of molding member. CONSTITUTION: An adhesive tape(11) is formed in a carrier plate(10). A plurality of dies(12) are mounted on the adhesive tape. The die is encapsulated on the adhesive tape through a molding member(13). A light is projected in the lower part of the carrier plate. The carrier plate including the adhesive tape is separated from the molding member. The carrier plate is formed with glass or quartz. |
