发明名称 CONTACT HALL FORMING METHOD, ELECTRIC CONDUCTION POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MANUFACTURING METHOD FOR MULTILAYER WIRING BOARD, AND MANUFACTURING METHOD FOR ELECTRONIC DEVICE
摘要 A method for forming a contact hole includes forming a lyophobic area by applying a liquid droplet of a lyophobic material on a region for forming a contact hole on a wiring, the lyophobic material being lyophobic to a liquid that contains an insulating layer forming material; and forming an insulating layer by applying a droplet of the liquid containing the insulating layer forming material so as to cover the wiring except for the lyophobic area, wherein the contact hole formed penetrates through the insulating layer to be connected to the wiring covered by the insulating layer.
申请公布号 KR101008792(B1) 申请公布日期 2011.01.14
申请号 KR20080055163 申请日期 2008.06.12
申请人 发明人
分类号 H01L21/28 主分类号 H01L21/28
代理机构 代理人
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