发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a polishing device reducing the separation of a slurry.SOLUTION: The polishing device performing polishing with use of a slurry (2), which is a fluid including grinding particles, includes: a slurry feeding source (3) feeding the slurry (2); a polishing section (13) performing polishing; pipes (4, 8) feeding the slurry (2) from the slurry feeding source (3) to the polishing section (13); a force feed cylinder (5) force feeding the slurry (2); a part valve (9) blocking the current between the pipes (4, 8) and the polishing section (13); and flow reversing means (11) reversing a flow of the fluid in the pipes (4, 8). The flow reversing means (11) discharges the slurry (2) in the pipes (4, 8) to the outside of the pipes (4, 8) by reversing the flow of the fluid in the pipes (4, 8) while the part valve (9) is shut.
申请公布号 JP2011005590(A) 申请公布日期 2011.01.13
申请号 JP20090151403 申请日期 2009.06.25
申请人 DENSO CORP 发明人 NIINUMA KENICHI
分类号 B24B37/00;B24B31/00 主分类号 B24B37/00
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