| 摘要 |
PROBLEM TO BE SOLVED: To cut a plate material by covering an electronic component with a tape member while separating the electronic component from the tape member without forming a projection on one surface of the plate material serving as a substrate.SOLUTION: The plate material 100 having a plurality of substrate forming regions 110 on one surface is prepared, a first component 21 and a second component 22 higher than the first component 21 are mounted on each substrate forming region 110 as the electronic components, and then the tape member 200 is applied onto one surface of the plate material 100 to cover one surface of the plate material 100 and the electronic components 21, 22. In this applying step, the tape member 200 is applied to a cut part 120 of the plate material 100 and is applied to the second component 22 such that the second component 22 supports it to cover the first component 21 out of contact with the tape member 200. Then, the plate material 100 is cut from the other surface opposite to the surface covered with the tape member 200 into units of the respective substrate forming regions 110. |
