METHOD OF MELTING SOLDER, METHOD OF MANUFACTURING PACKAGING SUBSTRATE, AND SOLDER MELTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method of melting solder, appropriately melting solder for connecting electronic components to a substrate.SOLUTION: When n×n solder balls of BGA (Ball Grid Array) are disposed in vertical and horizontal directions, laser beams are applied at an angle ("A" in the figure) inclined by an angle θ to an array direction of the solder balls. The laser beams are applied to all the solder balls by moving irradiation points of the laser beams to a direction ("B" in the figure) crossing the direction "A".