| 摘要 |
PROBLEM TO BE SOLVED: To provide methods and systems for monitoring semiconductor fabrication processes.SOLUTION: A system includes a stage configured to support a specimen and coupled to a measurement device. The measurement device includes an illumination system and a detection system. The illumination system and the detection system are configured to determine multiple properties of the specimen. For example, the system is configured to determine multiple properties of a specimen including: critical dimension and overlay misregistration; defects and thin film characteristics; critical dimension and defects; critical dimension and thin film characteristics; critical dimension, thin film characteristics and defects; macro defects and micro defects; flatness, thin film characteristics and defects; overlay misregistration and flatness; an implant characteristic and defects; and adhesion and thickness. In this manner, a measurement device can perform multiple optical and/or non-optical metrology and/or inspection techniques.SELECTED DRAWING: Figure 12 |
