| 摘要 |
A surface protective sheet comprises an adhesive layer having a plurality of layers on one side of a base film, the adhesive layer having a 25° C. storage elastic modulus of 10 to 100 MPa, and an adhesive strength with respect to a silicon mirror wafer of 1.0 N/20 mm or less at peeling off the surface protective sheet. The surface protective sheet is used for a semiconductor wafer having a protruding electrode of 10 to 150 μm height on its surface.
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