METHOD FOR LASER SINGULATION OF CHIP SCALE PACKAGES ON GLASS SUBSTRATES

摘要

An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates 84, 90 into an assembly 10 containing multiple devices 12. Presented are methods for singulation of compound electronic devices 12 using laser processing 80. The methods presented provide fewer defects such as cracking 58 or chipping 39 of the substrates 36, 50 while minimizing the width of the kerf 142 and maintaining system throughput.