发明名称 HEAT DISSIPATION STRUCTURE OF ELECTRIC APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electric apparatus with high heat dissipation effect which is able to easily dissipate the heat generated from electronic components to the outside to prevent the heat from being transmitted to the rotation position sensor.SOLUTION: A metal electromagnetic wave shielding member 11 having a first portion 11a jointed to the counter wall portion 9a of a case body 9 so as to face a circuit board 7 and a second cylindrical portion 11b rising from the circumference of the first portion 11a and extending along the circumferential wall portion 9b of the case body 9 without contacting a housing 17 is fixed to the case body 9. A heat transfer member 13 having electric insulation, thermal conductivity and flexibility is disposed closely contacted with a plurality of electronic components 33 to 39 and the first portion 11a of the electromagnetic wave shielding member 11 between the circuit board 7 and the electromagnetic wave shielding member 11.
申请公布号 JP2011009708(A) 申请公布日期 2011.01.13
申请号 JP20100096186 申请日期 2010.04.19
申请人 SANYO DENKI CO LTD 发明人 MIYASHITA TOSHIHITO;HIOKI HIROSHI;CHIKU JUNICHI
分类号 H05K7/20;H05K9/00 主分类号 H05K7/20
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