| 摘要 |
PROBLEM TO BE SOLVED: To provide: a copper foil for printed wiring board whose surface is made smooth enough to be sufficiently adaptive to various technical requirements that a copper foil, for example, for a COF tape etc., needs to meet; a method of manufacturing the copper foil for printed wiring board; a copper foil for printed wiring board, in which contact with (adhesion to) an insulating substrate can be secured by performing roughening processing to a desired roughness after achieving such surface smoothing; and a method of manufacturing the copper foil for printed wiring board.SOLUTION: The copper foil for the printed wiring board is set to be used while stuck on a surface of the insulating substrate 4, and a flattening copper plating layer 2 which gives a kurtosis Rku of ≤4 and a skewness Rsk of ≤0 to a roughness curve, defined by JIS B0601-2001, of a surface set to be stuck on the insulating substrate 4 is provided on an original foil 1. |
