| 摘要 |
PROBLEM TO BE SOLVED: To provide a device mounted wafer for which an energization test of each device formed thereon can be reliably performed in an on-wafer state even if the wafer is a bonded wafer, to provide a device chip that can be reliably tested for energization in an on-wafer state, and to provide a method of manufacturing the same.SOLUTION: A bonded wafer made by bonding a semiconductor layer 12 on a wafer 11 for a support substrate via a bonding interface 14 is used for the device mounted wafer. In the device mounted wafer 10, semiconductor devices 13 are built in a plurality of chip regions 10b divided by scribe lines 10a. By forming electrical isolation grooves 15 having such a depth as to exceed the bonding interface 14 along the scribe lines 10a, the semiconductor devices 13 are built in an electrically isolated state. |
