| 摘要 |
PROBLEM TO BE SOLVED: To provide a three-dimensional circuit board formed by pasting a film-like circuit board to the surface of a columnar or cylindrical casing, wherein a resin is flatly embedded in a gap generated between ends of the circuit board without damaging a wiring.SOLUTION: In the method, a film-like circuit board 12 having a wiring formed on one surface of an insulative film is pasted all around the surface of a casing via an adhesive 11 so that a wiring 15 is the inside, a resin is filled into the gap 1 generated between the ends of the film-like circuit board 12 after pasting, an excessive resin is removed by a squeegee 30, and the surface of the filler 20 is smoothed so that the height of the filler can be the same as that of an end of the insulative film formed on the uppermost surface of the film-like circuit board 12. |
