| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin sealed coil component for preventing lead free solder from flowing out via a gap between an outer covering body and a lead terminal to the external part of the outer covering body, so as to excellently mount an electronic component onto a mounting substrate, and also to provide a manufacturing method of the resin sealed coil component.SOLUTION: Communication passages 40A are formed in a mold member 40. Each communication passage 40A has a columnar shape and is formed to allow the axial direction to be oriented in a direction to connect a mounting surface 40a to an opposite mounting surface 40b. One end of each communication passage 40A is opened in the opposite mounting surface 40b so as to form an opening part, and the other end of the communication passage 40A is adjacent to an internal connection line member 30. Thus, the communication passages 40A communicate the internal connection line member 30 with the external space of the mold member 40. |
