CIRCUIT BOARD VIA STRUCTURE AND METHOD FORMING THE SAME

摘要

A printed circuit board (“PCB”) (100) includes a first routing layer (110), a second routing layer (120) and a via hole structure (150) electrically connecting the two routing layers. The via hole structure (150) includes a connecting hole (158) extending between the first routing layer (110) and the second routing layer (120), an inner conductor (154) positioned in the connecting hole (158), an outer conductor (152) substantially surrounds the inner conductor (154), and an insulating medium (156) positioned between the inner conductor and the outer conductor. The outer conductor (152) is insulated from the inner conductor (154), the outer conductor (152) is configured to connected to the ground, and the inner conductor (154) is configured to transmit signals.