THERMOSETTING COMPOSITION FOR PROTECTIVE FILM FOR WIRING BOARD

摘要

Disclosed is a thermosetting composition for a protective film for a wiring board, which has excellent low warpage properties, flexibility, and long-term insulation reliability. The thermosetting composition for a protective film for a wiring board comprises, as essential components, an epoxy group-containing compound having a tricyclodecane structure, polyurethane having a structural unit represented by formula (1) and having a functional group which can react with an epoxy group, and a solvent. In formula (1), R1 represents an alkylene group having 3 to 18 carbon atoms, and n represents an integer of 1 or more. As the epoxy group-containing compound having a tricyclodecane structure, a compound represented by formula (2) is preferably used.