| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board capable of surely and rigidly connecting an electrode of a semiconductor element and a bonding pad through a bonding wire.SOLUTION: The wiring board includes: a first insulating plate 6 having a first aperture 6a for storing a semiconductor element 3, first wiring conductors 11 formed on upper and lower surfaces and a first bonding pad 11a formed on the upper surface around the first aperture 6a; and a second insulating plate 8 having a second aperture 8a larger than the first aperture 6a and second wiring conductors 12 formed on the upper and lower surfaces, laminated on the upper surface of the first insulating plate 6 through an adhesive layer 7 so as to expose the first bonding pad 11a, and forming a second bonding pad 12a on the upper surface around the second aperture 8a. In the wiring board, a band-like resin layer 22 is formed in an area at the outer peripheral side of the second aperture 8a on the upper surface of the first insulating plate 6 and corresponding to a formation area of the second bonding pad 12a. |
