MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device including a semiconductor element which has favorable characteristics.SOLUTION: A manufacturing method includes steps of: forming a first conductive layer which functions as a gate electrode on a substrate; forming a first insulating layer to cover the first conductive layer; forming a semiconductor layer on the first insulating layer so that the semiconductor layer partially overlaps with the first conductive layer; forming a second conductive layer to be electrically connected to the semiconductor layer; forming a second insulating layer to cover the semiconductor layer and the second conductive layer; forming a third conductive layer to be electrically connected to the second conductive layer; performing first heat treatment after forming the semiconductor layer and before forming the second insulating layer; and performing second heat treatment after forming the second insulating layer.