发明名称 THREE-DIMENSIONAL MOUNTING BOARD, AND METHOD OF MANUFACTURING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a three-dimensional mounting board achieving impedance matching even when Z-direction wiring resultantly becoming inductive wiring exists.SOLUTION: A second printed wiring board 2 is arranged to be laminated through a space in the board thickness direction of a first printed wiring board 1. A Z-direction wiring part 3 is arranged in the board thickness direction through a space between the first printed wiring board 1 and the second printed wiring board 2 to connect the first printed wiring board 1 to the second printed wiring board 2. End opening stubs 91, 92 each made to be capacitive are arranged in connection parts between the Z-direction wiring part 3, and the first printed wiring board 1 and the second printed wiring board 2.
申请公布号 JP2011009505(A) 申请公布日期 2011.01.13
申请号 JP20090152183 申请日期 2009.06.26
申请人 SONY CORP 发明人 TSUKAMOTO SOTARO
分类号 H05K1/02;H01L23/52;H01L25/065;H01L25/07;H01L25/18;H05K1/14;H05K3/46 主分类号 H05K1/02
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