发明名称 ELECTRONIC COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To make it possible to carry out suction and removal of an electronic component with stability even in a seam region of an accommodated tape connected by means of a splicing tape.SOLUTION: At the intermittent feeding of an accommodated tape C, a counter 109 starts counting of the number of feeding of the accommodated tape C when a seam detecting apparatus 102 detects a seam (detects the existence of a splicing tape 108C). Then, the counter 109 carries out counting every for the feeding operation. When the head of the all suction unstable region comes to a component suction and removal position and the counter 109 counts "N-1", a CPU 110 determines that the head of all the suction unstable regions comes to the component suction and removal position, from the counting value. By determining in this way, since this section gives influence to the suction and removal of the electronic component, control is performed so as not to carry out a feedback process, and a pocket recognition process is carried out instead of the feedback process.
申请公布号 JP2011009471(A) 申请公布日期 2011.01.13
申请号 JP20090151591 申请日期 2009.06.25
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 WATANABE AKIO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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