发明名称 VACUUM TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a vacuum treatment apparatus which can shorten a period of time for heating a supplied substrate and can shorten a tact time.SOLUTION: This vacuum treatment apparatus includes: susceptors 11 and 12 which are movably provided in a communicating region 9 and mount a substrate to be treated 10 thereon; a transportation device 8 that transports the susceptors 11 and 12 to a first position at which a communication opening 1a is closed and a load lock chamber region 7 is sealed when carrying the substrate in and carrying the substrate out, and transports the susceptors 11 and 12 to a second position at which a communication opening 1b is closed and a treating chamber region 4 is sealed when a film is formed; and O-rings 41 and 62 which are sandwiched between the perimeters of the communication openings 1a and 1b and the mounting board when the susceptors 11 and 12 are transported to the first and second positions. The susceptors 11 and 12 have a mounting part 101 which heats the mounted substrate to be treated 10 and keeps the substrate at a predetermined temperature, and a sealing part 102 which is adiabatically provided on the mounting part 101, and accordingly can prevent the thermal deterioration of the O-rings 41 and 62.
申请公布号 JP2011006726(A) 申请公布日期 2011.01.13
申请号 JP20090149576 申请日期 2009.06.24
申请人 SHIMADZU CORP 发明人 KITAHARA MASARU;SAKAGUCHI SUMUTO
分类号 C23C16/44;H01L21/205;H01L21/31 主分类号 C23C16/44
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