| 摘要 |
PROBLEM TO BE SOLVED: To provide a multiple forming wiring substrate which suppresses electrical short circuit between adjacent inner connection conductors and conductor layers, and a wiring board.SOLUTION: A plurality of through-holes 105 are formed adjacently in a boundary 109 of a wiring board region 102 arranged in a matrix in a plane in a mother board 101. A conductor layer 110 whereto a wiring conductor 104 is connected via an inner connection conductor 106 is applied to an inner side surface of the through-hole 105. In each inner connection conductor 106 in adjacent through-holes 105, any one of adjacent end part each thereof is retreated from the boundary 109 along an inner surface of the through-hole 105 in plane view and a multiple forming wiring substrate is formed by enlarging a clearance to another inner connection conductor 106. Since a clearance between mutual end parts of the adjacent inner connection conductor 106 is enlarged, it is possible to effectively suppress electrical short circuit therebetween. |
