| 发明名称 |
Alloy Nano Particle of Sn-Cu-Ag, Preparation Method Thereof and Ink or Paste Using The Alloy Nano Particle |
| 摘要 |
<p>The invention relates to Sn-Cu-Ag alloy nanoparticles, preparation method thereof and ink or paste using the alloy nanoparticles in which the alloy nanoparticles are suitable for metal ink having excellent electrical conductivity or solder materials having low calcinating temperature.</p> |
| 申请公布号 |
KR101007326(B1) |
申请公布日期 |
2011.01.13 |
| 申请号 |
KR20080078611 |
申请日期 |
2008.08.11 |
| 申请人 |
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发明人 |
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| 分类号 |
B22F9/18;B22F1/00;B22F9/00;B22F9/24;B23K35/22;B23K35/26;C09D11/00;C09D11/52;C22C13/00;H01B1/22;H01B5/00;H01B13/00 |
主分类号 |
B22F9/18 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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