| 摘要 |
PROBLEM TO BE SOLVED: To attain a resin-reinforced structure suppressing a short supply of solder occurring in a pin mounting component not ensuring an extremely large gap due to stress relaxation to a lead caused by disposition of a mounting insertion pin on a component lower surface and reduction in connection reliability caused by a component structure and ensuring insulation around the lead to increase the reliability in mounting in a large-sized pin insertion component.SOLUTION: A mounting structure 1 is formed by inserting the insertion pin 3 into a through-hole 5 in a printed wiring board 4 to solder-bond it in mounting the pin insertion component 2 with the insertion pin 3 formed on its lower surface 2a onto the printed wiring board 4. A reinforcing resin 7 which is fuse-solidified or fuse-cured under the influence of its surrounding temperature is formed along the lower surface 2a of the pin insertion component 2. |
