发明名称 COPPER POWDER FOR CONDUCTIVE PASTE, AND CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide copper powder for conductive paste which does not impair both of oxidation resistance and electric conductivity regardless of fineness in grain size, and further is less in variation of shape and grain size, and is low content oxygen concentration, and to provide the conductive paste.SOLUTION: The copper powder for conductive paste contains, at the inside of each particle, Al, Mg, Ge and Ga by 0.1 to 10 atm%, and also comprises 0.1 to 10 atm% In.
申请公布号 JP2011006739(A) 申请公布日期 2011.01.13
申请号 JP20090151361 申请日期 2009.06.25
申请人 MITSUI MINING & SMELTING CO LTD 发明人 ODA AKIHIRO;SASAKI TAKUYA;YOSHIMARU KATSUHIKO
分类号 B22F1/00;C22C9/00;C22C9/01;H01B1/02;H01B1/22;H01B5/00 主分类号 B22F1/00
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