发明名称 SOLDER ALLOY AND ELECTRONIC CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a lead-free solder alloy having the fatigue life equivalent to or longer than that of a lead-containing solder, and to provide an electronic circuit board using the solder alloy.SOLUTION: The solder alloy 5 contains ≥90 mass% Sn, and the balance containing one or more kinds of additive elements to be selected among a group consisting of Ag, Cu, Zn, Bi, Sb and In, and further contains <0.01 mass% inevitable impurities other than the additive elements.
申请公布号 JP2011005510(A) 申请公布日期 2011.01.13
申请号 JP20090149940 申请日期 2009.06.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 IDETA GORO;SUGANUMA KATSUAKI;KIN SEISHUN
分类号 B23K35/26;C22C13/00;H05K3/34 主分类号 B23K35/26
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