发明名称 |
MATERIAL FOR FORMING ELECTROLESS PLATE, COATING SOLUTION FOR ADHERING CATALYST, METHOD FOR FORMING ELECTROLESS PLATE, AND PLATING METHOD |
摘要 |
There is provided a material for forming electroless plate which shows favorable catalyst adhering property, and shows no delamination of catalyst adhering layer from non-conductive base material, no dissolution of catalyst adhering layer into a plating solution, and no discoloration of interface of plate layer with catalyst adhering layer during the catalyst adhering step, development step and other steps. A material for forming electroless plate comprising a non-conductive base material and a catalyst adhering layer provided on the non-conductive base material is constituted so that the catalyst adhering layer should comprise a water-insoluble polyester resin, and surface of the catalyst adhering layer should show a contact angle of 60° or smaller to purified water.
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申请公布号 |
US2011005936(A1) |
申请公布日期 |
2011.01.13 |
申请号 |
US20080525469 |
申请日期 |
2008.02.01 |
申请人 |
KIMOTO CO., LTD.;KANTO GAKUIN UNIVERSITY SURFACE ENGINEERING RESEARCH INSTITUTE |
发明人 |
OHTA TETSUJI;KITAMURA KEIKO;WATANABE MITSUHIRO |
分类号 |
C25D5/56;B01J31/02;B05D3/10 |
主分类号 |
C25D5/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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