| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer having a defined and advantageous characteristic of the back surface of the semiconductor wafer.SOLUTION: A method of manufacturing the semiconductor wafer is characterized by having the steps of: (a) preparing a semiconductor wafer by cutting a silicon rod into wafers; (b) rounding edges of the semiconductor wafer such that the semiconductor wafer has a surface which is flat on the front and back sides and a surface which is rounded and inclined in an edge region; and (c) polishing the front and back surfaces of the semiconductor wafer, wherein in polishing the front surface, chemical mechanical polishing using a polishing pad containing abrasive grains fixed in the polishing pad is used, polishing of the back surface of the semiconductor wafer is performed in three steps in each of which a polishing pad having an abrasive material bonded in the polishing pad is used and a polishing pressure is applied onto the back surface of the semiconductor wafer. In the first step, an abrasive having no solid is introduced between the polishing pad and the back surface of the semiconductor wafer, in the second and third steps, an abrasive having an abrasive material is introduced, and in the third step, the polishing pressure which is 8-15 psi in the first and second steps is reduced to 0.5-5 psi. |
