| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device capable of achieving not only relaxation of thermal stress between a structure including a semiconductor element and its supporter, but also suitable suppression of thermal resistance although having a simpler structure.SOLUTION: The structure 300 including the semiconductor element 310 is constituted by integrally bonding a cooler 100 supporting the structure through a stress relaxation layer 200 relaxing stress generated between the structure 300 and the cooler 100. The stress relaxation layer 200 is composed as a coupled body and formed as a concavity/convexity engagement structure of many concavities and convexities, surfaces opposed to each other as coupling surfaces being so shaped as to relax movement orientation toward surfaces of the cooler 100 and structure 300. |
