| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressurized ultrasonic vibration bonding method and a pressurized ultrasonic vibration bonding device suppressing deflection of a lead wire regardless of use of pressurized ultrasonic vibration bonding in bonding the lead wire to a thin substrate.SOLUTION: The thin substrate 11 is disposed on a predetermined table 10. Then, the conductive lead wire 12 is disposed on the substrate 11. Then, the lead wire 12 is bonded to the substrate 11 by applying ultrasonic vibration onto the lead wire 12 while putting predetermined pressure onto the predetermined table 10 side by using bonding tools 4, 5. Here, the ultrasonic vibration is applied to the lead wire 12 while pressing the both sides of an ultrasonic vibration applied part of the lead wire 12 toward the predetermined table 10 side by a pressing member 9. |
