| 摘要 |
A connection device includes a ground electrode layer that is provided in a substrate, a first transmission path that is provided on the ground electrode layer via a dielectric layer, and a plurality of leads that are connected to the first transmission path and the ground electrode layer or the first transmission path and a plane that is electrically connected to the ground electrode layer. The plurality of leads are fitted into through-holes that are provided in a second transmission path and a ground electrode on a flexible substrate to be electrically connected.
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