摘要 |
PURPOSE: A downward spray-type substrate etching apparatus is provided to increase productivity and yield by uniformly spraying an etching solution on a substrate by oscillating at least one of a spraying member and/or cassette. CONSTITUTION: A downward spray-type substrate etching apparatus includes a loading member(20) containing a cassette(210) in which one or more substrates(211) are perpendicularly loaded; a spray member(10) including a nozzle fixing portion and at least one nozzle unit(110), which sprays an etching solution to the loading member; and a first driving member for controlling the nozzle fixing portion to be oscillated. |